Mitsui Mining & Smelting to Increase Ultra-Thin Copper Foil by 30%

Mitsui Mining & Smelting increases ultra-thin copper carrier foil for IC package substrates, announced on Thursday. The firm expands the output capacity at Ageo plant, Saitama, Japan to 600,000 square meters per month from 450,000 square meters. The firm plans to expand the capacity more to 1 million square meters when the demand increases.

Forming of fine-pitch IC substrates becomes easy with ultra-thin copper foil for IC package substrates by Mitsui Mining & Smelting. The adoption of the foil increases when the circuit of substrates miniaturizing progresses. The foil shipment increases not only in Japan but also in Korea, Taiwan and China.

Mitsui Mining & Smelting began No.1 and No.2 plant build-up in Ageo. The plant starts the operation with 600,000 square meters per month of capacity after the obtaining customer certification. The firm plans to increase the capacity by 400,000 square meters at No.2 plant in Ageo.