Japanese Major Lead-Free Solder’s Patent Expires in July

Japanese major solder makers’ patent currently expired for tin-silver-copper type lead-free solder. The patented solder represents 80-90% shares in lead-free solder market. However, other solder makers would have larger chances than ever to sell their original lead-free solders.

The patented solder contains 96.5% tin, 3% silver and 0.5% copper. This is Japanese original lead-free solder which doesn’t interfere with European solder patent. Most of Japanese set makers presently adopts this lead-free solder.

The patent expired on July 8, which was a joint license of Senju Metal Industry and Nihon Superior. However, the patent actually expired only for Senju Metal Industry. Nihon Superior is licensed by U.S. university and this license term holds two years left. Thus Nihon Superior renewed the domestic patent on July 9.

As a result, the patent fee becomes a half. The patent users can reduce the fee cost.