Nippon Mining & Metals Develops 450mm Silicon Test Wafer

Nippon Mining & Metals announced on Wednesday the firm developed polycrystal silicon test wafer with 450 millimeters of diameter for the first time in the world. The firm produces the wafer at sinter facility in Isohara plant in Ibaraki, which is the production base for electronic materials. The firm launches the wafer in 2008 selling annual 1,000-2,000 units for semiconductor making machinery makers. The test wafer is used by semiconductor making machinery makers to develop the making process along with the technology of semiconductor makers. The wafer is not used for semiconductor making. The firm tries to supply the next generation material and contribute to innovation in electronic devices making industry. Semiconductor makers use 200 mm or 300 mm silicon wafer as substrate material. They plan to use 450 mm wafer in future to reduce cost and improve efficiency.