Nippon Mining & Metals to Start UBM Manufacturing Service

Nippon Mining & Metals announced on Tuesday the firm starts a new service to manufacture under bump metallurgy (UBM) by its non-electrolytic nickel/gold plating process in January. The new process takes less costs and manufacturing lead time than previous methods such as electrolytic plating and sputtering. By using the original plating agent and process, the firm enabled manufacturing of consistent UBMs which are not influenced by potential and size differences between pads.Electric appliances are expected to become even smaller and more functional. Along the trend, semiconductor wafer market would continue to grow up. LSI is being more integrated and complicated including three-dimension wiring and packaging methods. Nippon Mining & Metals intends to start a solder bumping manufacturing service 2 years later following these trends.